Multi-tabs Tool based Notching & Slitting Machine

Equipment Features

These features maintain mechanical die-forming stability during high-speed tabbing and slitting operations.

• Dedicated mechanical structure for multi-tabs electrode forming
• Integrated die-cutting and slitting architecture
• Servo-driven tension control to prevent tab deformation
• Multi-stage rectification for long-run stability
• Dual-side tab forming capability
• Targeted dust collection at cutting and slitting zones

Core Advantages: Die-Cutting vs. Laser Cutting

Die-Cutting (Hardware)

• Mechanical Stability & Cost Efficiency: Ideal for standardized electrode designs with limited format variation, offering a mechanically stable and cost-effective solution.
• Low Operational Variability: For long production runs, stable tab geometries, and a small number of electrode models, it eliminates frequent parameter tuning and format revalidation. Once tooling is finalized, production changeover time and operational variability are significantly reduced.
• Predictable Costs: Requires lower initial equipment investment and delivers predictable operating costs when model diversity is limited.
• Best For: Mature consumer electronics, light EV, and small energy storage applications where process stability, throughput consistency, and controlled manufacturing costs are primary objectives.

Laser Cutting

• Material Integrity: Enables non-contact electrode processing, eliminating mechanical stress on thick or high-loading coatings. This is critical in EV and ESS electrode development, as preserving coating integrity directly impacts achievable energy density and cycle stability.
• Design Flexibility: Removes mold dependency, allowing faster design iteration and format changes during R&D and pilot stages.
• Future-Proofing: For manufacturers validating new chemistries or scaling large-format electrodes, it offers a future-proof path that balances precision, flexibility, and material utilization efficiency.
• Best For: R&D, evolving designs, and high-flexibility applications requiring uncompromised material integrity.